Challenges of Depaneling Routing
Damages and fractures to substrates and circuits due to mechanical stress
Damages to PCB due to accumulated debris，Constant need for new bits, custom dies, and blades
Lack of versatility – each new application requires ordering of custom tools, blades, and dies Not good for high precision, multi-dimensional or complicated cuts Not useful PCB depaneling/singulation smaller boards
Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings.
There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.
